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AMITEC focuses on design, fabrication, test and assembly of high performance
electronic substrates. These substrates are based on miniature Printed Wiring
Boards (PWBs) with Ball Grid Array (BGA) pads on their underside and thin film
multi-layer structures on their topside. By attaching a chip to the thin film top layer
of the substrate, and then assembling the substrates' BGA side to a PWB, AMITEC's
substrate becomes a powerful interconnect solution within the electronic system.
This substrate bridges the ever increasing gap between high performance chips
and their related PWBs, while ensuring chips' speed, signal integrity and power
requirements.
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