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AMITEC substrates are designed and manufactured to support the next
generation Integrated Circuits (ICs) also known as "flip chips".
The substrates are designed and built to support flip chips with
more than 2000 I/Os (Inputs/Outputs), pitches of less than 150µm and with
speed requirements that exceed 40GHz. By utilizing advanced polymer dielectric
and
by applying AMITEC's patented micro-via technology, these substrates
ensure
higher assembly and operating temperatures (>260°C) along with superior
flatness
and power distribution capabilities. AMITEC's substrate represents the
most
cost effective solution for high density high speed IC
packaging on the market.
The substrates are built in an IC environment (Class 10 clean rooms),
using IC
fabrication equipment that can support feature sizes and tolerances far
beyond
those offered by "conventional" PWB related substrate technologies.
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