Copper Pillars:
1. Pillar Diameter: 200µm (Standard) / 150µm (Advanced)
2. Metalization: Copper. Thickness: 60µm

Core-less
1. Dielectric Material: Polyimide/Composite
2. Number of Cu Layers: 2 to 5 (BGA Pad Layer, Inner-Layers, Capture Pad Layer)
3. Total Thickness: 75µm to 275µm.
4. Optional: Metal Core

BGA Pad Layer
1. Final Metalization: 0.1µm Gold over 5µm Nickel
2. Solder Mask (SM): Not Applicable
3. Pad to Copper Pillar Diameter: 350/200µm (Standard). 300/150µm (Advanced)

Copper Lines in Core-less
1. Line Thickness: Capture Pad Layer: 5µm. Other Layers: 15µm
2. Minimum Line Width: Capture Pad Layer: 50µm. Other Layers: 75µm
3. Minimum Space Between Lines: Capture Pad Layer: 50 µm. Other Layers: 75µm
4. Power/Ground Line Thickness: 15µm, 35µm

Thin Film Build-Up Dielectric
1. Dielectric Material: BCB (Benzo-Cyclo-Butene) - Enhanced Formulation
2. Maximum Number of Copper Layers: 3 (Signal X, Signal Y, Flip Chip Pad & Ground)
3. Maximum Thickness of BCB Layers: 50µm
4. Maximum Thickness of Single BCB Layer: 20µm
5. Preferred Thickness of Single BCB Layer: 10µm

Via Post (Micro-Via)
1. Metalization: Filled Aluminum 1% Copper
2. Via/Pad Top Diameter: 25/45µm (Preferred). 10µm/30µm (Minimum)
3. Via/Pad Bottom Diameter: 45/60µm (Preferred). 30µm/45µm (Minimum)
4. Vertical Power/Ground Path: Stacked Via Posts

Thin Film Build-Up Copper Lines
1. Line Thickness: 3µm, 4µm, 5µm
2. Minimum Line Width: 15µm
3. Minimum Space Between Lines: 10µm

Flip Chip Pad (Bump Side)
1. Final Metalization: 0.1µm Gold Over 3µm Nickel (Minimum Thickness)
2. Resistivity: 70µ x cm, 1m for Nickel Layer 5µm Thick
3. "Via in Flip Chip Pad" Technology
4. Solder Mask (SM): Photo Defined, Epoxy Based
5. Minimum Solder Mask Thickness: 5µm
6. Minimum Solder Mask Diameter: 50µm
7. Solder Mask Defined Configuration (Preferred): Pad Diameter - SM Diameter = 10µm
8. Non-Solder Mask Defined Configuration: SM Diameter - Pad Diameter = 10µm

Flat Bumps on Substrate
Solder On Pad (SOP)
1. Minimum Pitch:150µm
2. Bump Thickness Above Solder Mask: 30µm±5µm
3. Bump Top Diameter Tolerance (Coined): ±10%
Metal On Pad (MOP)
1. Minimum Pitch:70µm
2. Metalization: Ni/Au (Same as for Flip Chip Pad)
3. Bump Thickness Above Flip Chip Pad: 25µm±0.5µm
4. Bump Top Diameter Tolerance: ±3%