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The electrical system
performance is determined by the chips, packaging and interconnection technology.The
primary function of the package and the
interconnection scheme is to minimize delay time and
reduce electrical noise. AMITEC's thin film substrate is the most
logical choice for the package while flip chip
utilizing Solder on Pad (SOP) or Metal on Pad
(MOP) technologies provide the best Chip-to-Substrate interconnecting
technology.
The evolution to larger chips, followed by increasing
chip I/O's (Inputs/Outputs), demand increase in power
requirements and switching performance. Power
nets and bus lines can be wired through the
thick Copper planes in the substrate core. By connecting these
planes to the chip through stacked micro-vias, an overall
performance
enhancement of the thin film lines can be achieved. |
