Electrical

			MISSION ACTIVITY I.D CARD

			BACKGROUND OVERVIEW FEATURES

			RELIABILITY ELECTRICAL DESIGN RULES

			PRESENTATIONS

			PERSONNEL CAREERS

Substrate Thick Film Layers: Core or Core-less

Substrate Core-less
1. Dielectric Constant (@ 1 MHz): 4.46, (Advanced: 3.38)
2. Dissipation Factor (@ 1MHz): 0.013 Advanced (@ 10GHz): 0.0025
3. Withstand Voltage: 1.5KV/mil
4. Types of Impedance Lines: Strip-Lines & Dual Strip-Lines
4. Characteristic Impedance Range for Transmission Lines: 25 to 100
5. Impedance Line Tolerance: ±10%
6. -3db Bandwidth up to 49GHz (Along the total Signal path from bottom to top).
7. Advanced: Lumped Elements (Inductors/Capacitors).

Substrate Thin Film Layers:

Electrical Charactaristics of Thin Film Layers

Substrate Thin Film Layers
1. Dielectric Constant (@ 1KHz-20GHz): 2.55
2. Dissipation Factor (@ 1MHz): 0.0008, (@1-10GHz): 0.002
3. Withstand Voltage: 400V/µm
4. Via Series Resistance: < 10m

per one Via (10µm Diameter)
5. Via Inductance (10µm Diameter): 5.7pH
6. Via Capacitance (10µm Diameter): 6.0fF
7. Resistivity of Thin-Film Metal Line: 2.08µ

-cm
8. Type of Impedance Lines: Micro-Strips, Strip-Lines
9. Optional: Differential Pair Lines and Voltage Split in Ground Planes
10. Characteristic Impedance Range for Transmission Lines: 25

to 100

11. Impedance Line Tolerance: ±5%
12. Delay: 130ps/inch
13. -30db Cross Talk at 45GHz.

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