| |
|
Substrate Core-less |
| Feature |
Standard |
Advanced |
Optional |
| Dielectric Material | PI/Composite | PI/Composite | PI/Composite | | Tg (°C) | 260 | 260 | 260 | | Dielectric Constant | 4.46 | 4.46 | 4.46 | | Line Thickness (µm) | 15 | 10 | 5 | | Line/Space (µm) | 75/75 | 65/65 | 50/50 | | Number of Layers | 2-3 | 4 | 5 | | Copper Pillar Diameter (µm) | 200 | 150 | 125 | | Blind/Stacked Pillars | Yes | Yes | Yes | | Metal Carrier Before C/A | Frame or Full | Frame or Full | Frame or Full | | Ball Pitch (mm) | 1.27-1.00 | 0.80 | 0.65 |
|
|
| Substrate Thin Film Layers |
| Feature |
Standard |
Advanced |
Optional |
| Dielectric Material | BCB*
| BCB*
| BCB*
| | Tg (°C) | 350 | 350 | 350 | | Dielectric Constant | 2.55 | 2.55 | 2.55 | | Line Thickness (µm) | 3 | 4 | 5 | | Line/Space (µm) | 15/15 | 15/10 | 10/10 | | Number of Layers | 2 | 3 | 4 | | Blind & Stacked Via | Yes | Yes | Yes | | Via in Flip Chip Pad | Yes | Yes | Yes | | Via/Pad Diameter (µm) | 25/50 | 10/30 | 10/30 | | Bump Pitch (µm) | 180 | 150 | 100 |
|
