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One
of the most important parameters characterizing
the performance level of an advanced Flip Chip
BGA (FCBGA) package is it's bandwidth. Package
bandwidth significantly depends on the
transmission lines running in and on the substrate. A
transmission
line
bandwidth
is
identified
by
the
highest
frequency that can be transferred through a transmission
path with an acceptable loss. A customary acceptable bandwidth is >
-3dB of energy passes. Usually a lot of design and
process attention are given to the substrate’s
transmission lines in the XY planes
(layers) due to their considerable length. However, as
frequency climbs up, one must pay attention to signal loss due
to Z axis signal passage through the substrate.
AMITEC core-less substrate perfectly addresses this
issue, enabling up to 6 XY layers with total thickness of less
then 300µm, allowing maximum Signal, Power and Ground management
while ensuring
minimum signal loss through the package.
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