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In AMITEC's substrate,
the micro-vias, electrically connecting the build-up layers in the z-axis, are
metal filled. The manufacturing technology used to create these
micro-vias, involves metal pillar formations followed
by dielectric coating and polishing steps to expose the pillars top surfaces. Following, another
build-up metal layer can be formed on top of each exposed
pillar (via) surface allowing electrical contact
as designed. This patented interconnect technology
allows parallel formation of hundreds of thousands
of vias per substrate with minimum via
diameter of 10µm. Since all vias are filled
and planarized, they can be structured directly under
the flip chip
pads of the substrate. This saves expensive real-estate on the
substrate surface, allows more wiring to go in and out from the chip
and
reduces the total number of build-up layers. |
