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From development to market and from design to assembly,
AMITEC provides a "total technology solution" of high performance
chip carriers and Flip Chip Ball Grid Array (FCBGA) substrates
for advanced packaging applications.
AMITEC's mission is to make its innovative leading-edge,
high density, high speed, substrate technology available to the microelectronic packaging
industry and to position itself as an enabling technology provider for the further growth
of the semiconductor industry. |
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