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As flip chip's
I/Os (Inputs/Outputs) become thighter in pitch and as their number is
rapidly increasing, it becomes critical to ensure that the electrical
contacts to the substrate pads are reliable and remain
so for the entire lifetime of the package. AMITEC's substrate is built
to assure long term reliability of the flip chips attached to it's thin film
build-up pads.There are two options to secure reliable
flip chip electrical contacts to AMITEC's substrate: Solder on Pad (SOP)
and Metal on Pad (MOP).In SOP method, substrate's
pre-assembled flip chip pads include flat solder bumps available in various compositions ranging
from eutectic to high-lead,to lead-free.In MOP method,substrate's
pre-assembled flip chip pads include metal bumps coated
with Ni/Au.The SOP technology is usually applied in flip chip pads
with pitches as low as 180µm while the MOP is usually applied in pitches
of 150µm and below. |
