Core-less Substrate Advantages:

-   "Standard" Build-Up Core Substrates are limited in routing capability and have

    prohibitive Plated Through Hole (PTH) pitches.

-  Core-less Substrates utilize filled micro-via technologies to allow stacked vias and

   "via in pad" structures.

   filled micro-vias perform better thermally.

-  Signal attenuation through the core-less substrate is reduced due to lower package

   thickness.

-  Core-less Technology cuts one order of magnitude in Z-axis inductance.

-  Core-less structure enables substrates with new material set to better meet IC

    requirements.