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AMITEC substrate core
is built from Polyimide laminates capable of withstanding operating temperatures as high as 260°C for many hours. Unlike
BT materials used for "conventional" flip chip BGA substrates, the Polyimide core keeps AMITEC substrate flat even when temperatures as high
as 300°C are reached during the chip assembly processes. The typical flatness values across the diagonal of an assembled 40mm x 40mm AMITEC
substrate were found to be less than 0.001" when measured at 220°C. |
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