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| | 1. AMITEC Introduction (PDF, 1.95MB,28/06/2004) |
| | Introducing AMITEC Ltd. – Turn key Packaging and Substrate solutions close to you! |
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| | 2. AMITEC Coreless Package (PDF,1.64MB,28/06/2004) |
| | An overview presentation highlighting AMITEC`s revolutionary Coreless Package. |
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| | 3. AMITEC Coreless Substrate Design Rules (PDF,726KB,28/06/2004) |
| | Material set description and deign rules for AMITEC`s revolutionary Coreless Substrate. |
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| | 4. AMITEC MOP Bumping Technology (PDF,1.32MB,28/06/2004) |
| | Technical overview presentation describing AMITEC`s MOP (Metal On Pad) bumping technology enabling assembly of Ultra Fine Pitch (UFP) Flip Chip devices over the AMITEC substrate.
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| | 5. AMITEC_Coreless_Thick_Film_Only_Layers (PDF,46 KB,20/12/2004) |
| | Ten reasons to choose AMITEC Core-less substrates utilizing "thick film only" layers.
The most cost effective substrate technology for stacked dies/stacked packages.
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| | 6. AMITEC_Coreless_Thick_and_Thin_film_Layers (PDF,55.7 KB,20/12/2004) |
| | Ten reasons to choose AMITEC Core-less substrates utilizing both "thick and thin film" layers.
The most cost effective substrate technology for advanced FCBGA packages. |
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