| |
|
 |
|
| Test |
Specification |
Condition |
Level |
Time/Cycle |
Results |
| Structural |
Continuity |
Isolation |
| Temp. Cycle* | JESD22-A104-B | -55C to 125C (B) | Substrate**/Chip | 1000 Cycles | Pass | Pass | Pass | | Thermal Shock* | JESD22-A106-A | -55C to 125C (C) | Substrate**/Chip | 1000 Cycles | Pass | Pass | Pass | | Solder Dipping | IPC-TM-650 2.6.8 | 288C, 10 Sec | Bare Substrate | 10 Cycles | Pass | Pass | NA | | Solder Reflow | AMITEC Internal | 250C Max. 20 Sec | Substrate**/Chip | 5 Cycles | Pass | Pass | NA | | High Temp. Storage | JESD22-A103-B | 150C | Bare Substrate | 1000 Hrs | Pass | Pass | NA | | High Temp/Humidity | JESD22-A101-B | 85C/85% RH | Bare Substrate | 1000 Hrs | Pass | Pass | NA | | High Temp/Humidity | JESD22-A101-B | 85C/85% RH/5.5V | Bare Substrate | 1000 Hrs | Pass | NA | Pass | | Temp. Cycle* | JESD22-A104-B | 0C to 125C (K) | Board/Substrate**/Chip | 1500 Cycles | Pass | Pass | Pass |
|
| * Includes Pre-Conditioning Level 3 as per JESD22-A113-B |
| ** For Both SOP and MOP Substrate Bumping Technology |
|
