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All
AMITEC Core-less Substrates come in BGA format ranging from body size of
5X5mm up to 50X50mm. Ball count can reach over 2300 balls per substrate.
Available ball pitches are 1.27mm, 1.00mm, 0.8mm, 0.65mm and 0.40mm. Due
to the processing nature of the core-less substrate, the BGA
pad (with Ni/Au
coating over Copper) is on the same Z axis level of the insulating dielectric
material thereby eliminating the need for BGA side solder mask and improving
pitch resolution.
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