FCBGA Package: Core with Thin Film Layers

 

 

     Copper Capped PTH (Plated Through Hole)
         
In order to allow the flow of electrical  information  from  one side  of the substrate core to it's other side, PTHs (Plated Through Holes) are required. As PTHs utilize real estate on the substrate top  surface, they need to be plugged so that  build-up layers can be  built on top. However, in most substrate technologies, these PTHs are plugged with dielectric material that can not serve as an electrical ground layer for the build-up layers on top. In the AMITEC substrate, on the other hand, all PTHs are capped with a Copper layer. This  helps to  further boost  controlled impedance lines structured within the build-up layers and to improve the overall reliability of the substrate itself.
 
                Copper  capped  PTH  is shown on  the  right side of  this cross section picture. Note  the  thickness  of the  thin-film  build-up  layers (20µm) compared  to  the core  material thickness with the PTH (1.0mm).
 

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