FCBGA Package: Core-less with Thin Film Layers

 

 

     Multichip Package (MCP) vs. Single Chip Package (SCP)
         
AMITEC's  substrate can offer  Multi-Chip Package (MCP) as  well  as Single  Chip Package (SCP) all  in a BGA  JEDEC  format. While AMITEC's  thin  film  SCPs offer significant technical advantages over  "conventional"  substrate  technologies such as  higher  I/O numbers, finer pitches, higher speeds and  enhanced  power distribution capabilities, the AMITEC thin film MCP can offer an even more revolutionary approach  to the  sub-electronic  system. In  the MCP concept, shift of active metal lines from the chip  to the thin film portion of the substrate can  be achieved, thereby creating  chips with  higher complexity, improved  performance, reduced size  and lower cost. The significant advantages  offered  by the MCP approach are shown in the following table:
SIA Roadmap Key Problems AMITEC MCP
High Chip Power @ Low Vdd Very High Supply Current Off-Chip Power Distribution
Small Feature/ Line Size Very High Line Resistance Off Chip Busses
Logic with RAM on Chip Process Optimization Build high Density RAM with Optimized IC Process Separate from Logic
Large Die Size Poor Yield (Defect Density) Optimize Die Size for Yield without Limits on Complexity and Functionality
Number of Transistors per I/O Pin Access/Personalization for Various Applications Block-Level Access to Resources
Many On-Chip Metal Layers Complex Process Parallel Processing of Substrate and Chip

 

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