FCBGA Package: Core with Thin Film Layers

 

 

    Multichip Chip Package (MCP) vs. Single Chip Package (SCP) 
         
AMITEC's substrate can offer Multi-Chip Package (MCP) as well as Single Chip Package (SCP) all in  a BGA JEDEC  format. While  AMITEC's thin  film  SCPs offer significant  technical  advantages  over "conventional"  substrate  technologies  such as  higher I/O numbers,  finer  pitches, higher   speeds and  enhanced  power  distribution  capabilities,  the  AMITEC thin  film  MCP  can  offer an even more  revolutionary approach to the sub-electronic  system. In the MCP concept, shift of active  metal lines from the chip to the thin film portion of the substrate can be allowed, thereby creating chips with higher complexity,  improved performance, reduced size  and  lower cost.  The significant advantages offered by the MCP approach are shown in the following table:
 
          
SIA Roadmap Key Problems AMITEC MCP
High Chip Power @ Low Vdd Very High Supply Current Off-Chip Power Distribution
Small Feature/ Line Size Very High Line Resistance Off Chip Busses
Logic with RAM on Chip Process Optimization Build high Density RAM with Optimized IC Process Separate from Logic
Large Die Size Poor Yield (Defect Density) Optimize Die Size for Yield without Limits on Complexity and Functionality
Number of Transistors per I/O Pin Access/Personalization for Various Applications Block-Level Access to Resources
Many On-Chip Metal Layers Complex Process Parallel Processing of Substrate and Chip
 

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