FCBGA Package: Core-less with Thin Film Layers

 

  

     Thick Film Layer
         
AMITEC core-less substrate thick film section is built from  Polyimide  composite laminates  capable of withstanding  operating  temperatures as  high as 340ºC  during chip  attach  assembly process. With proper selection of the materials and application process, a so called “stressed balanced” core-less package can be achieved. The “stressed balanced” core-less package is characterized by low CTE and improved flatness that minimizes stress over the chip’s ILD layers and bumps.
 
               

   
     Flat package is a stressed balanced package and stressed balanced package minimizes chip deformation

 

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