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"Conventional"
Build-up layers are usually manufactured by employing lamination processes
on the substrate core.These processes create an
overall stress on the core material that needs to be balanced
by building the same number of layers from each sides of the core. AMITEC's substrate utilizes fairly low stress thin film build-up layers
enabling a complete functional substrate with build- up layers structured
only from the chip side of the substrate
core. Compared to other technologies, AMITEC creates a complete substrate
with less build-up layers, less manufacturing
steps, higher production yields and lower cost. |
