FCBGA Package: Core-less with Thin Film Layers

 

 

     Thin Film Layers
         
AMITEC Offers a fully proven core-less organic Substrate with thin film build-up layers. Based on the same material, tools  and  methodologies  used  by  chip  manufacturers, AMITEC offers  the first and  only  commercially  available organic  core-less  substrate  employing  thinfilm  build-up integrated layers.The two main advantages offered by thin film build-up layers are: density and signal integrity.

 
AMITEC's Thin Film Build-Up                             "Standard" Build-Up Technology                     
               
      - Conductor Surface Roughness < 0.1µm 
      - Micro Via Inductance:5.7pH  
      - Dielectric Constant=2.55 Td = 0.001    
      - Line width Control: ±1µm 
      - Dielectric Spacing Control: ±10%		     - Conductor Surface Roughness < 1.0µm
    - Micro Via Inductance:191.1pH 
    - Dielectric Constant=3.4 Td = 0.013 
    - Line width Control:±5µm 
    - Dielectric Spacing Control: ± 45%

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