FCBGA Package: Core with Thin Film Layers

 

 

     Thin Film Layers
         
AMITEC Offers a fully proven organic substrate technology with thin film build-up layers.  Based  on  the same  materials, tools and methodologies  used by chip manufacturers, AMITEC offers the first and only commercially available PWB substrate employing thin film build-up integrated  layers. The two biggest  advantages offered by AMITEC's substrates  are density and signal integrity at high  frequencies. AMITEC regularly employs its novel  design, fabrication and test capabilities to introduce leading-edge flip chip BGA substrates. Some  of these  substrates  have more than 2000 I/Os (Inputs/Outputs), while others support  chips operating at 40Ghz.
 
                Top view of 3 thin film build-up layers,as seen on an  AMITEC substrate.The lines are 10µm wide and the pad sizes  are  20µm. The micro-vias, electrically connecting  the build-up layers in the z-axis,are 10µm in diameter. 
 

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